IMR's Research Enhancement Program provides different funding mechanisms to support novel research at The Ohio State University. Seven IMRG Research projects were awarded a second year from IMR for an additional $287,500 in direct research support from IMR.

2010 IMRG Renewals IMR provided $287,500 in direct funding to support the second year of these successful IMRG research projects: 

  • Multi-Scale Characterization of Battery Materials for Improved Performance 
    • Lead: Sudarsanam Suresh Babu, Industrial, Welding and Systems Engineering and Materials Science and Engineering; 
    • Co-Applicants: Bharat Bhushan, Mechanical Engineering; Yann Guezennec, Mechanical Engineering; Giorgio Rizzoni, Mechanical Engineering; Shrikant C. Nagpure (PhD Student), Mechanical Engineering 
  • Metamaterials with Smart Reconfiguration for Broadband RF Antennas 
    • Lead: Marcelo Dapino, Mechanical Engineering; 
    • Co-Applicants: Suresh Babu, Industrial Systems Engineering; John Volakis, Electrical and Computer Engineering. 
  • Structure-Property Relationships in Novel Structural Materials 
    • Lead: Katherine Flores, Materials Science and Engineering 
  • Economical Platforms for FET-based Protein Detection to Support Sensor Clinical Translation 
    • Lead: Stephen C. Lee, Biomedical Engineering; 
    • Co-Applicant: Paul Berger, Electrical and Computer Engineering. 
  • Use of Electrospun Biomaterials as Carriers of Bone Marrow Derived Stem/Progenitor Cells to Stimulate Tissue Neovascularization 
    • Lead: Nicanor I. Moldovan, Internal Medicine; 
    • Co-Applicant: John J. Lannuti, Materials Science and Engineering.
  • Exploring Electrically Tunable Magnetism in Gd-doped Nitride Quantum Structures 
    • Lead: Roberto C. Myers; Materials Science and Engineering & Electrical Computer Engineering; 
    • Co-Applicants: Ezekiel Johnston-Halperin, Physics; Michael Mills, Materials Science and Engineering. 
  • Synthesis of III-V Semiconductor Nanowire Heterostructures Using Metalorganic Chemical Vapor 
    • Lead: Fengyuan Yang, Physics; 
    • Co-Applicants: Ezekiel Johnston-Halperin, Physics; Roberto C. Myers, Materials Science and Engineering & Electrical and Computer Engineering