IMR’s Research Enhancement Program provides different funding mechanisms to support novel research at The Ohio State University. Five new research projects were awarded by the IMR in June 2009, for a total investment of $225,000. Three IMRG research projects also received a second year of funding from IMR for an additional $130,000 in direct research support from IMR.
2009 IMRG Research Projects: New Research
Metamaterials with Smart Reconfiguration for Broadband RF Antennas
Lead: Marcelo Dapino, Mechanical Engineering; Co-Applicants: Suresh Babu, Industrial Systems Engineering; John Volakis, Electrical and Computer Engineering.
Economical Platforms for FET-based Protein Detection to Support Sensor Clinical Translation
Lead: Stephen C. Lee, Biomedical Engineering; Co-Applicant: Paul Berger, Electrical and Computer Engineering.
Use of Electrospun Biomaterials as Carriers of Bone Marrow Derived Stem/Progenitor Cells to Stimulate
Lead: Nicanor I. Moldovan, Internal Medicine; Co-Applicant: John J. Lannuti, Materials Science and Engineering.
Exploring Electrically Tunable Magnetism in Gd-doped Nitride Quantum Structures
Lead: Roberto C. Myers; Materials Science and Engineering & Electrical Computer Engineering; Co-Applicants: Ezekiel Johnston-Halperin, Physics; Michael Mills, Materials Science and Engineering.
Synthesis of III-V Semiconductor Nanowire Heterostructures Using Metalorganic Chemical Vapor
Lead: Fengyuan Yang, Physics; Co-Applicants: Ezekiel Johnston-Halperin, Physics; Roberto C. Myers, Materials Science and Engineering & Electrical and Computer Engineering
2009 IMRG Renewals
IMR also provided $130,000 in direct funding to support the second year of these successful IMRG research projects:
Experimental and Computational Study of ALD-grown Dielectrics on III-Nitrides
Lead: Siddharth Rajan, Electrical and Computer Engineering and Materials Science and Engineering; Co-Applicant: Wolfgang Windl, Materials Science and Engineering
IMRG Research Award to Supplement Center for Emergent Materials Program
Lead: Katherine Flores, Materials Science and Engineering
Solving the “Contact Problem” of Molecular Electronics via Atomic Layer Deposition
Lead: Ezekiel Johnston-Halperin, Physics; Co-Applicants: Jonathan Pelz, Physics; Malcolm Chisholm, Chemistry